SlabCutter 15/200

The SlabCutter 15/200 is Zenna's innovative laser module for cutting plant-hole-patterns in substrate foil will offer you many advantages compared with the traditional substrate cutting systems. These systems ways of cutting holes and shapes into substrates is a very labor intensity process, which can be done much easier! 

The Slabcutter 15/200 can cut any pattern in a slab that passes at a line speed of 60 m/min. It can handle slabs of maximum 200mm width and has no limitation in the length of the slabs. The minimum height for cutting the substrates slabs is 80 mm, and the maximum allowable height 120 mm.

The Slabcutter 15/200 module houses a 1.500 Watt CO2 laser and a scanner to manipulate the laser beam and create the shapes. The cutting compartment has an interlock door that guarantees the laser safety class 4 and also takes care of smoke removal. 

Other benefits of the Slabcutter 15/200 are:


Cutting plant-hole-patterns in hydroculture slabs with a laser laser encounters a growing in popularity versus traditional cutting with a knife of heated mall. The use of a laser for cutting foil offers several advantages compared with the more traditional ways like: 

  • Precision: a laser cuts always with very high a constant precision, no tools getting blunt or sticky 
  • Flexibility: any shape or logo can be cut "on the fly"
  • No Deformation: a laser generates minimal heat impact on the surrounding material, reducing the risk of deformation or melting of the foil 
  • Automation and Reproducibility: the cutting proces can be automated, ensuring consistent results and repeatability. This is advantageous in mass production and when producing identical cutting patterns
  • Versatility: laser cutting can be adapted easily for different foil materials and thicknesses. They can also cut various types of patterns, making them more versatile
  • Less Waste: Due to the precision of laser cutting, the material can be utilized as efficiently as possible, resulting in less waste compared to knife cutting


The process


The SlabCutter is installed behind the flow packer and before the stacking device. The hydroculture slabs run on a belt through the cutting station. This belt is equipped with vacuum holes to prevent the substrate from shifting during cutting.

A sensor recognizes the passing substrate and triggers the laser to cut the desired pattern at the right location 'on the fly.' Due to the fact that the substrate is cut while moving on the conveyor belt, a high output can be achieved. Behind the cutting station an optional flap removal unit is installed. It sucks the loose flaps from the slab and releases these in a big bag or bin.


SlabCutter Compact 5/200

If a line speed of 30 m/min is sufficient or if space is very limited, the SlabCutter Compact 5/200 is the right solution. In a single housing the laser, scanner, controls and manifold are all included. Only the chiller is placed next to this compact module.

The SlabCutter Compact 5/200 is equiped with a sealed-of laser of 450 Watt and a smaller chiller. All other parts like software, controls and scanner are similar to the larger SlabCutter.